MediaTek Dimensity 9000+ Released, Ready to Be the Life of HP Flagship

 


MediaTek showcased its latest flagship chipset, the Dimensity 9000+, with a number of improvements over the Dimensity 9000. What are they?

The main improvements are a 5% increase in CPU performance and a 10% increase in GPU. Then there are also improvements in the image signal processing sector and 5G modems.


The Dimensity 9000+ combines Arm's v9 CPU architecture with a 4nm Octa-core process, also integrating one ultra-Cortex-X2 core operating up to 3.2GHz (as opposed to the Dimensity 9000 operating up to 3.05GHz) with three Cortex-A710 supercores and four Cortex-A510 cores.



"Building on the success of our first flagship 5G chipset, the Dimensity 9000+ ensures that device manufacturers always have access to high-performance and advanced features and are equipped with the latest cellular technologies, enabling their high-end smartphones to stand out," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business Unit, in a statement received by us.


"With a suite of AI, gaming, multimedia, imaging and connectivity features, the Dimensity 9000+ delivers faster gameplay, smoother streaming and an overall better user experience."


Following are the main features of MediaTek Dimensity 9000+:


MediaTek Imagiq 790: The flagship 18-bit High Dynamic Range (HDR) Image Signal Processor (ISP) (18-bit HDR-ISP) supports 320MP resolution, as well as triple-camera 18-bit HDR video recording. In addition to the power of a reliable 9Gpixels per second ISP it also supports 4K HDR Video + AI noise reduction which enables the highest quality image results, even in extreme low light.

Best 3GPP Release-16 5G Modem: With integrated 5G modem strengthens sub-6GHz performance up to 7Gbps downlink using 3CC Carrier Aggregation (300MHz) and supports R16 UL upgrade. The Dimensity 9000+ also incorporates 5G/4G Dual SIM Dual Active support and MediaTek's 5G UltraSave 2.0 power-saving device for increased efficiency.

MediaTek MiraVision 790: Dimensity 9000+ supports the latest 144Hz WQHD+ display or superfast 180Hz FullHD+ display while optimizing power efficiency with Intelligent Display Sync 2.0 technology. In addition, the latest Wi-Fi Display technology can also support videos up to 4K60 HDR10+.

Wi-Fi 6E, GNSS with Beidou III-B1C, and the latest Bluetooth 5.3: Smartphone users can enjoy seamless connectivity thanks to the chip's support for the latest Wi-Fi, Bluetooth, and GNSS standards.

Phones with Dimensity 9000+ are expected to be available in the market in Q3 2022.

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