MediaTek Denies Heating Issue On Dimensity 9300



A few days ago we reported that the MediaTek Dimensity 9300 chip had heating problems in early tests. This chip is for flagship devices, competing with Snapdragon 8 Gen 3 and Apple A17 Pro. It is also the successor to the current Dimensity 9200+.

Recently, Android Authority received feedback from MediaTek. MediaTek informed that the Android Headlines report is false and no source can confirm it. There are other reports stating that the heating issue occurs because the Dimensity 9300 does not use a small-core design but only uses the main and intermediate cores.

It's still too early for us to see a device with this chip. MediaTek can also work with device manufacturers to ensure the software is compatible with the chip and can provide an optimized user experience. The Dimensity 9300 will likely stick with 4nm with a combination of Cortex-X4, Cortex-A720 and Cortex-A515 CPUs.