Intel has just introduced their 15th generation laptop processor chip, Intel Lunar Lake which features a brand new design and features that make it one of the best AI capable CPU components on the market today.
During the Intel Tech Tour event that took place last week, Intel has confirmed that the Lunar Lake chip is manufactured using the N3B (3nm) process by TSMC. It is explained that this happened because the Intel factory with the Intel 3 process was not yet ready when the Lunar Lake chips were supposed to be released.
However, during Intel's keynote event this morning, Pat Gelsinger showed the first semiconductor wafer of their next generation chip, Intel Panther Lake and confirmed that the processing chip will once again be manufactured by Intel itself, using the Intel 18A process (18 Angstrom @ 1.8 nm) which is expected to be launched in mid-2025.
Previously there were several reports saying that the Panther Lake chips would be manufactured with that process, but it was only confirmed by Intel's CEO himself today. Not many details are known about Panther Lake right now, but the expectation is that it will feature higher IPC values, TOPS and lower power consumption in the future.