Samsung and Broadcom have signed an MOU to expand their strategic collaboration in memory and foundry technology to support next-generation artificial intelligence (AI) infrastructure. The value of the collaboration is more than $200 billion (~RM 817 billion) over five years to 2030, covering memory production and the use of Samsung’s foundry.
Samsung will supply high-performance memory chips including HBM to support Broadcom’s next-generation AI drivers. Samsung’s 2nm and below chips will be used to manufacture Broadcom products, including Wireless Broadband Communications (WBC).
This is a major contract for Samsung Foundry, which this year also won a contract to produce chips for Tesla. Meanwhile, OpenAI and Broadcom last month announced the construction of their own Jalapeño chip to reduce reliance on NVIDIA.
