Micron is reportedly testing its latest memory module—a 512GB DDR5-9200 unit—designed for data centers that require massive memory capacity combined with high speeds.
This memory module features an RDIMM design, commonly used for stacked memory configurations to achieve higher capacity within a single module while ensuring greater power efficiency. Micron states that a single 512GB module consumes only 16W of power, compared to the 44W required by four 128GB modules.
The module has reportedly undergone testing by Intel and AMD for their server platforms, demonstrating satisfactory performance; it is expected to undergo further testing by Micron's existing customers soon. With this module, a dual-socket server equipped with 24 memory slots could accommodate a total of 12TB of memory.
Micron is expected to begin mass production of this memory in mid-2027, with production volumes contingent on customer demand. The module is anticipated to enable increased memory capacity while simultaneously reducing power consumption.
