After releasing the Dimensity 9000 some time ago, MediaTek will again hold an event in China on December 16, 2021.
Some rumors say that at the event MediaTek will reveal more information about the D9000, but will also release the Dimensity 7000, whose leaked specifications have already been circulating.
The D7000 is said to have eight cores which are divided into four Cortex-A78 cores of 2.75GHz and four Cortex-A55 cores with a speed of 2.0 GHz.
The D7000 will also be equipped with the Mali-G510 MC6 graphics chip, which also supports 75W charging. From the leaks, it seems that this system on a chip (SoC) will be a challenger to the Snapdragon 870.
Among other MediaTek SoCs, the D7000 will be positioned between the Dimensity 1200 and D9000. Then reportedly Xiaomi, Redmi to be precise, may be the first device maker with the SoC, as previously stated by Redmi GM Lu Weibing.
Currently the D7000 is said to have just entered the testing phase, but the launch will occur in December 2021, or it could be January 2022. The first phone with the D7000 is likely to be released in Q1 2022.
Previously reported, MediaTek claimed that the D9000 was equivalent to the Apple A15 Bionic and superior to the Snapdragon 888.
The Dimensity 9000 is the world's first chipset to be manufactured with the Armv9 4 nm process architecture. This SoC has a configuration of 1 Cortex-X2 core clocked at 3.05 GHz, 3 Cortex-A710 cores clocked at 2.85 GHz and 4 Cortex-A510 cores clocked at 1.8 GHz.
All of these supplies make MediaTek dare to boast that the chipset is the most powerful to date. The Dimensity 9000 is said to have 35% faster CPU and GPU performance than Snapdragon 888.
In terms of artificial intelligence (AI), MediaTek claims that the Dimensity 9000 chip also beats the Google Tensor chip, the chip that Google says has the strongest AI performance for mobile phones.
