The Oppo Find X6 series is believed to be launched in China around April. As a flagship device that emphasizes camera capabilities, the Find X6 will come with a powerful processor and a MariSilicon X chip. Last weekend, images of the device said to be the Find X6 pro were leaked to the website.
It confirms the design that appeared in the previous mockup image. The rear panel has a large round bump like the one found on the Xiaomi 12S Ultra. Hasselblad branding and the main tricamera system are clearly visible. Two large lenses are arranged horizontally and another lens with a periscope zoom is placed at the bottom.
The finish of the back panel also looks a bit rough similar to the finish on the Find N2 Flip. In addition, the front has a curved screen on the side and also a selfie camera hole. Not much official information about this device is known other than that it uses Snapdragon 8 Gen 2 and will also be equipped with a 1″ main sensor. For readers who want to buy it, you will be disappointed because it has been heard that the Find X6 Pro will not be marketed globally.