Universiti Sains Malaysia (USM) recently signed a memorandum of understanding with Purdue University from the United States and leading semiconductor component manufacturer Intel to develop their first advanced semiconductor research lab.
Apart from the collaboration between the two universities, USM is also the first university outside the United States to receive access to the Intel 18A Process Design Kit, a set of process documents that allows researchers and semiconductor chip companies to research and develop their semiconductor chips according to the specifications required to enable them to be manufactured using the process.
The collaboration between USM, Intel and Purdue University also strengthens research capacity and semiconductor talent development in the field of advanced chip and system design, through the support of 18A PDK technology, industrial EDA platform and joint academic programs that allow students and researchers to design real chips, undergo international academic exchanges.
As is well known. Intel Core Ultra 300 “Panther Lake” laptop processing chips that will be introduced early next year use this semiconductor production process.
Director-General of the Department of Higher Education, Datuk Professor Dr. Azlinda Azman, who officiated the ceremony, said, "Today's ceremony is not just a laboratory launch or a signing of a collaboration, but a clear statement that Malaysia is preparing to enter a new era of global leadership in the semiconductor field," because Malaysia is no longer an observer of world innovation, but an active contributor through increased mastery of chip design and advanced technology."
