Intel announced an additional investment worth RM860 million to make Malaysia an assembly and operational test hub. The announcement was made by Intel CEO Lip-Bu Tan during a meeting with Prime Minister Dato’ Seri Anwar Ibrahim yesterday.
This additional investment is seen as a reflection of the belief in the New Industrial Master Plan 2030 and the country’s long-term planning. In the same meeting, Intel expressed its appreciation for the Malaysian government’s continued support, especially for the development of an advanced packaging facility in Penang, which involved a capital expenditure of RM12 billion and is now 99% complete.
Although Intel experienced financial issues last year, this project is still ongoing but has been readjusted to market conditions. Meanwhile, the construction of two factories in Germany and Poland has been postponed for two years and will only be resumed after looking at market demand.
The Prime Minister also welcomed Intel’s collaboration with educational and training institutions that have received funding commitments of RM2.8 million over the past two years. Among the initiatives that have been undertaken is the collaboration between Universiti Sains Malaysia (USM) which signed a memorandum of understanding with Purdue University from the United States and Intel to develop their first advanced semiconductor research laboratory last week.
