During the Mobile World Congress 2026 event held in Barcelona, Spain last week, Samsung announced that they have a plan to completely shift their semiconductor chip manufacturing workforce to the use of Agentic AI by 2030.
This AI integration will involve the logistics processes of raw material entry, product production, quality assurance and even delivery to clients. To this end, Samsung will introduce a twin simulation system where data from all physical manufacturing processes will be fed to an AI agent developed by Samsung itself to see how the manufacturing process is carried out, and how it can be further optimized.
Meanwhile, Samsung will also introduce the use of agentic AI in the company's health, safety and environmental operations through proactive detection and automated hazard prevention systems in their component production plants.
The use of agentic AI technology will be combined with the development of robotic technology for manufacturing operations, logistics and the delivery of raw materials for processing in their factories.
Samsung expects its global DRAM and NAND component production factories to be automated with artificial intelligence and robots by 2030.
