At the AMD Advancing AI event currently underway in San Francisco, USA, AMD has shown the physical form and full design of their latest AI processing module series called AMD Ryzen AI Embedded X100 which will be used for the industrial sector soon.
This AI processing module comes with the use of the AMD Ryzen AI 300 Max “Strix Halo” processing chip which was shown on certain gaming laptops, but will be used as an AI computing module that will be utilized by the robotics, industrial automation, healthcare and other sectors.
The AMD Ryzen AI Embedded X100 series consists of six models, namely the AMD Ryzen AI Embedded X199, X188, X168 and similar models that come with the “i” classification. These CPU models with the “i” designation can operate in extreme temperatures, from -40 degrees Celsius to 105 degrees Celsius.
In terms of internal specifications, as we said, the AMD Ryzen AI Embedded X100 chip series is based on the AMD Zen5 processor series with AMD RDNA 3.5 graphics processing chips and AMD XDNA2 NPU.
In terms of memory support, AMD says that this processor chip will come with support for up to 128GB of built-in LPDDR5X-8533 memory for robotics, physical AI, and so on.
AMD also introduced a robotics system development platform called Kria AI Robotics Developer Platform, which is an AI SOM (AI System On Module) robotics technology building platform that combines CPU, GPU, NPU, and reprogrammable FPGA (Field-Programmable Gate Array) computing.
It also includes open source baseboard schematics and FPGA designs. The platform is being tested with AMD customers on an early access basis, with general availability expected in the fourth quarter of 2026.
