The year 2026 will see an increase in the selling price of memory components as most of the production capacity previously used to produce consumer components has been used to produce memory components for the data center and artificial intelligence industries.
The name ChangXin Memory Technologies or CXMT is seen increasing this year as they are seen as the biggest challenger to the oligopoly of the world's three largest memory manufacturers, including SK Hynix, Samsung and Micron.
Recently, there have been reports that computer manufacturers such as Apple, Lenovo and others have begun testing and using memory components produced by CXMT to reduce the cost of purchasing memory components for the devices they produce.
Citrini Research, a market analysis company, recently reported that CXMT is expected to produce 350 thousand wafers per month by the end of this year, almost matching the wafer production output produced by Micron, which is 375 thousand wafers per month. SK Hynix and Samsung are seen as formidable challengers with output of 600-700 thousand wafers per month.
CXMT has already started producing many types of memory wafers, including 16Gb with a data transfer speed of 8000MT/s, 24Gb with a speed of 6000MT/s, and also 12Gb and 16Gb memory with a speed of 10,000 MT/s for data center use.
Interestingly, CXMT was able to produce this large amount of memory without using the latest EUV lithography technology, but simply by optimizing their existing DUV process. The Chinese government has also asked CXMT to share their technological knowledge with other companies so that memory production from China can be increased dramatically.
