Xiaomi launched a flagship chip for their latest phone Xiaomi Xring O3. This chip is manufactured with TSMC's 3nm technology and is equipped with a 10-core CPU. It consists of 2 x 4.35 GHz C1-Ultra, 4 x 3.68 GHz C1-Premium and 4 x 3.15 GHz C1-Pro. The GPU used is the G2-Ultra NX with 16 cores for high graphics performance.
Xiaomi Xring O3 supports LPDDR6 memory and NPU with 3.13 TFLOPS power. In terms of performance, the CPU capability is 60% higher, the GPU is up to 85% higher and the NPU is 45% higher than the previous generation Xring chip. At the launch, Xiaomi revealed that the chip scored 5.22 million points in the Antutu 3D test. In the Geekbench test, 3,945 points were recorded in the single-core test and 15,221 points in the multi-core test.
The first two devices that will use the Xring O3 chip are the Xiaomi 18 Fold foldable phone and the Pad 9 Pro Max tablet, which will be launched in China next September
In addition to the Xring O3, the Xring O100 and Xring D100 chips. The Xring O10 uses 6nm technology, specifically for AI capabilities in phones, cars and even robots. Meanwhile, the Xring D100 is for self-driving systems equipped with a 20-core CPU, a 16-core NPU and supports up to 160GB of memory. It can run models with 200 billion parameters directly on the device and will be used commercially starting in 2027.
