Taiwan Semiconductor Manufacturing Company, or better known as TSMC will start manufacturing processing chips using 3nm process technology (N3) starting this September.
It was confirmed through a Commercial Times report which said that after a delay of several months, TSMC is finally ready to start High Volume Manufacturing or mass production of processing chips through the node.
The main advantage of TSMC's N3 process, apart from being able to fit more components in the same density area, is that it uses its own proprietary FINFLEX technology which allows TSMC to assemble different types of component cells.
This can help customers to not only improve the performance of their processing chips, but also to optimize power consumption, temperature levels and so on. Because of this, companies such as Apple, AMD and NVIDIA are seen as among the companies that will certainly be able to benefit from the use of this N3 process.
One drawback that can be shown by using this N3 process is that it will not provide a large amount of production at the beginning because this process is still using new technology that will affect the amount of production of this chip.
To fix this issue, TSMC will also reportedly introduce N3E, N3X and so on starting next year which will fix these issues.
According to the report, it is seen that Apple will be TSMC's first customer to use this process, after Intel is seen to no longer use TSMC's services to develop their processing chips.