AMD Wants to Develop Chip Design and Packaging Hub in Malaysia



Prime Minister Datuk Seri Anwar Ibrahim recently said that AMD, a leading chip design company, is interested in developing a chip design and packaging hub in Malaysia.


He said that a meeting was held with AMD CEO, Dr. Lisa Su, where they discussed the possibility of opening the hub in Penang in the future.


As is well known, Penang is one of the largest semiconductor chip packaging hubs in the Southeast Asian region, with names such as Intel, Micron and others having been established in the state for a long time. AMD also already has an office in Bayan Lepas, Penang, but this new project, if it happens, could be considered the company's largest investment in Malaysia to date.


Not many details are known about the hub, but Datuk Seri Anwar Ibrahim said that it will be responsible for helping to design next-generation semiconductor processing chips, and help in packaging their future processing chips.


He was speaking at the opening of the ECRL railway system operation and maintenance programme yesterday, where 102 trainees will be sent to Luzhou, China to learn the ins and outs of ECRL railway maintenance before the service opens soon.

Previous Post Next Post

Contact Form