Recently, memory component manufacturer Micron is reported to be developing a new GDDR7 memory technology in which the memory chips can be stacked similar to what is done in High Bandwidth Memory (HBM) memory.
This was reported by South Korean technology news site ETNews, which said that Micron is currently in the design and research phase and is looking at what additional equipment is needed to produce this new GDDR7 memory. For this initial phase, Micron is also reported to be trying to produce GDDR7 memory chips stacked with four layers of memory chips.
GDDR memory is typically used with GPU components to build gaming-class graphics cards, but with the processing chip manufacturing industry now fully focused on empowering the AI technology sector, Micron is said to be using this GDDR7 memory stacking technology to be used with AI processing technology first.
The advantages of this stacking technology, as can be seen in HBM memory, are that it can accommodate more GDDR7 chips, more efficient power consumption and also much faster data transfer speeds.
Micron is expected to test the production process of its stacked GDDR7 memory chips in the second half of this year, with the first samples of the memory chips appearing early next year. Technically, the memory chips could also be used in gaming-class graphics cards, but it is not known if Micron will sell the memory chips for that purpose.
