Oppo Find X6 Pro Leaked With All-New Design And Giant Camera Bump

 Oppo has its own line of flagship devices under the Find X series, most of which are equipped with various new technologies, both internally and externally. According to estimates, this series will continue with the Find X6, information about which has also been heard for the past few months.

The latest image of the Find X6 Pro mockup with a combination of leather and metal finish that resembles a previous Find X3 Pro Photographer's Edition. A significant change can be seen in the unique camera support on the back. Through it, it houses a giant round camera hump with a tri-camera system, one of which is believed to use a periscope lens.

Find X3 Pro Photographer Edition

This at the same time gives the impression that the device will have a high zoom capability. Also included is the Marisilicon X ISP chip and the familiar Hasselbald camera system to help improve mobile imaging systems. No word on the official launch date is known so far, but it is expected to arrive in the coming months.

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