As we all know, the AI market is currently in a frenzy to buy memory components for AI systems that need them as much as possible, and this has caused memory manufacturers to cCuuba to get as much profit as possible.
Recently, it was reported that SK Hynix, a leading memory and storage chip manufacturer from South Korea, will open an HBM memory packaging plant in the United States to speed up the production and delivery process of memory for AI component manufacturers in the country.
This 2.5D packaging plant will be built in West Lafayette, Indiana together with Purdue University and will cost about $2.5 billion and is expected to start operating in 2028.
SK Hynix usually uses external companies for this packaging process, where memory semiconductor chips are mounted on logic boards. Due to the increasing demand for AI memory chips, this process is seen as a bottleneck in the production of these chips before they can be sold.
Because of this, SK Hynix has decided to build their own packaging plant in the United States to speed up the process. But as it is said, this plant will only start operating in 2028, and will be built with the help of a CHIPS Act grant of $458 million.
They are also the first memory manufacturer to successfully produce the latest HBM4 memory chips recently.
